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PRESS RELEASES - MARCH 2005
Laguna Niguel, CA - EIMC - Advanced Plating Technologies announces expanded pulse plating capabilities with PlatingMaster electrolytic process simulation software.
PlatingMaster is being used to accurately model bi-polar pulsed plating applications in pwb manufacturing. Pulse plating, pulse reverse, bi-polar pulse plating or PPR, as it is sometimes called, has been difficult to apply because of varying board sizes and designs. PlatingMaster allows the process engineer to perform a fast prediction of deposit thickness distribution over tracks, pads, ground planes, robbers, etc. and represents a powerful tool for optimization of the pulsed signal and/or background patterns (copper balancing) that contribute to deposit uniformity specifications. Bipolar Pulse parameters (anodic and cathodic pulse height, anodic and cathodic on-time, off-time) can be easily specified in order to speed plating times and ease the plating production bottlenecks encountered in pwb electrolytic processing.
PRESS RELEASES - JANUARY 2005
Laguna Niguel, CA - EIMC–Advanced Plating Technologies has been appointed the North American representative for Elsyca’s plating software and engineering services. The latest software version of Elsyca PlatingMaster is true 3D, very user friendly and is completely integrated with SolidWorks®. SolidWorks® has one of the largest installed user bases in the world for CAD design software.
Laguna Niguel, CA - EIMC–Advanced Plating Technologies announces the availability of a new DEMO of PlatingMaster. The DEMO has 2 versions: one is of a single part and the other shows that part as it is integrated with other parts on a complete plating rack. Please email your request for either or both of the DEMOs to: firstname.lastname@example.org
PRESS RELEASE - SEPTEMBER 2003
EIMC - Advanced Plating Technologies introduces Modeling and Plating Simulation
Laguna Niguel, CA - EIMC - Advanced Plating Technologies (Electroplating Innovation in Modeling Concepts) announces expansion of capabilities with the addition of consulting and engineering services for electroplating process improvement.
The offer of contract engineering services is an alternative to software license acquisition and gives manufacturers and electroplaters more options to achieving uniform plating thickness distribution. The goals are to improve plating yield and increase plating speeds. Electroplating quality is enhanced so that overplating is eliminated. Plating thickness uniformity improvements result in significantly reduced plating cycle times and lower material costs. Plating process improvements can be made that bypass costly trial and error plating set-up and validation.
Plating improvements are also advantageous to fabricators who must employ longer-than- necessary plating cycle times, regularly face electroplating capacity restraints or are currently contemplating capital expenditures for additional electroplating equipment.
EIMC - Advanced Plating Technologies is leading the way to improved electroplating performance in US manufacturing.
For additional information, please email email@example.com
Chicago, Illinois, June 2002 - The AESF, the American Electroplaters and Surface Finishers Society, awarded Roger Mouton "Best Presentation In Conference" for his presentation of the technical paper "A New 3-D Electroplating Simulation and Design Tool". The paper was co-written with Frederic Druesne, PhD and Mr. Mansour Afzali of CETIM, Technical Centre for Engineering Industries, Senlis, France.
This award is given annually for the best presentation of a paper delivered at the preceding SUR/FIN Conference held in Nashville, TN. This paper is currently in publication in the June, 2002 issue of Plating and Surface Finishing, the technical journal of AESF, the American Electroplaters and Surface Finishers Society.
Roger Mouton founded EIMC, focusing on Advanced Plating Technologies and electroplating process
development. He has experience in product and business development, sales, marketing and technical
service in the electronics manufacturing and metal finishing industries. He has authored articles in
Printed Circuit Fabrication, CircuiTree Magazine and The Board Authority, Metal Finishing Magazine and Plating and Surface Finishing Magazine. He holds a B.A. in Economics from Loyola University.
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